Flip Chip Bonder at flip-chip-bonder.net

Flip Chip Bonder at flip-chip-bonder.net: Datacon is concentrating on flip chip bonder solutions.

Datacon, Flip Chip Bonder pioneers from the very beginning, offers you the ideal system for series production in this highly sophisticated technology. The Flip Chip Bonder steps - flip the component by 180 °, cover it in the dipping unit, position the component - can be processed in just one module.

Our vision is to successfully contribute to the advancement of microelectronics by addressing and implementing the current and future requirements of the fast-moving Flip Chip Bonder Market. Datacon plays an important role in the technical and social success of microelectronics & flip chip bonder.